New high-flow Ultramid Advanced for thin-walled connectors enables higher power and data throughput in electronic applications

BASF is now expanding its polyphthalamide (PPA) portfolio by a new Ultramid® Advanced N grade that is especially suited for connectors post-processed with surface mount technology (SMT). Ultramid® Advanced N2U40G7 shows the ideal balance of high flowability, toughness and flame retardancy. It thus enables miniaturization with thin-wall structures at high power and data throughput in electronic applications. Due to its […]

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